´ëÁø´ëÇб³ ¹é°æ°© ±³¼ö
µð½ºÇ÷¹ÀÌ ±¸µ¿È¸·Î ´ÜÀ§ Ĩ °³¹ß ÈÄ ¹ÙÀÌ¿À ¼¾¼¿¡ Àû¿ë °èȹ
ꡒ¹ÝµµÃ¼ °øÇÐÀº ´Ù·ç´Â ´ë»óÀÇ ±Ô¸ð¿¡ µû¶ó Àç·á, ¼ÒÀÚ, ȸ·Î, ½Ã½ºÅÛ µî ¿©·¯ ºÎ·ù·Î ³ª´¶´Ù. ÀÌ ¸ðµÎ°¡ °®´Â Ư¼ºÀº ¹ÝµµÃ¼¶ó´Â ¹°Áú(¿¹¸¦ µé¾î, ½Ç¸®ÄÜ)À» Ȱ¿ëÇÑ´Ù´Â °ÍÀÌ´Ù. ¹ÝµµÃ¼´Â °æ¿ì¿¡ µû¶ó µµÃ¼(Àü±â°¡ ÅëÇÔ)¿Í ºÎµµÃ¼(Àü±â°¡ ÅëÇÏÁö ¾ÊÀ½)ÀÇ Æ¯¼ºÀ» °¡Áö°Ô µÈ´Ù. ÀÏ¹Ý ½Ã¹ÎµéÀÌ ÀÌÇØÇϱ⿡´Â Á» ¹«¸®°¡ µû¸£Áö¸¸ Ã౸¿¡¼ ¸ÖƼÇ÷¹À̾î(multi-player)¶ó´Â ºÎºÐÀ» »ý°¢Çϸé ÀÌÇØÇϱ⠽¬¿ï °ÍÀÌ´Ù. 1¸íÀÇ ¼±¼ö°¡ °ø°Ýµµ ÇÏ´Ù°¡, ¼öºñµµ ÇÏ´Â ±×·± ¿ªÇÒÀÌ´Ù. Àü±âµµ ÅëÇß´Ù°¡ ¾î´À ¼ø°£¿¡´Â Àü±âµµ ÅëÇÏÁö ¾Ê´Â ±×·± ¿ªÇÒÀÌ ÇÊ¿äÇß´ø °ÍÀÌ´Ù. ÀÌ·¯ÇÑ Æ¯¼º°ú ¹ÝµµÃ¼ ±¤ÇÐÀåºñ¸¦ Ȱ¿ëÇÏ¿© ±²ÀåÈ÷ ÀÛÀº °ø°£¿¡ Å« µµ¸é(°ÇÃà°øÇÐÀÚ, µðÀÚÀ̳Ê, Á¶°¢°¡°¡ design ÇÏ´Â µµ¸éó·³)À» Ãà¼Ò º¹»çÇØ ³Ö´Â °ÍÀÌ´Ù. Áö±Ý ÇöÀç ¼¿·ê·¯Æù, LCD, PDP µîÀÇ °¡ÀüÅë½ÅÀåºñµéÀº À̸¦ Ȱ¿ëÇÏ¿© ³ª¿Â °ÍÀÌ´Ù.ꡓ
´ëÁø´ëÇб³ ÀüÀÚ°øÇаú ¹é°æ°©(43․»çÁø) ±³¼ö°¡ Àü°øÇÑ ¹ÝµµÃ¼¿¡ ´ëÇÑ ¼³¸íÀÌ´Ù. ¹é ±³¼ö´Â ÀüºÏ Àͻ걺 ¿ëµ¿¸é¿¡¼ ž ±º»ê ¹®ÈÃʵîÇб³, ±º»êµ¿ÁßÇб³, ÀüÁÖ½ÅÈï°íµîÇб³¸¦ ³ª¿Í °í·Á´ëÇб³ °ø°ú´ëÇÐ ÀüÀÚ°øÇаú °øÇлç, °øÇм®»ç, °øÇйڻç ÇÐÀ§¸¦ ÃëµæÇϰí 1994³â 3¿ù ´ëÁø´ëÇб³ ÀüÀÚ°øÇаú¿¡ ºÎÀÓÇß´Ù.
ÇöÀç ´ëÁø´ëÇб³ ÇлýµéÀ» ´ë»óÀ¸·Î ½ÇÇè½Ç½À ±³°ú¸ñÀ¸·Î ±âÃÊÀüÀÚ°øÇнÇÇè, ÀüÀÚȸ·Î½ÇÇè °ú¸ñ°ú ÀÌ·Ð ¹× ¼³°è ±³°ú¸ñÀ¸·Î ¹ÝµµÃ¼°øÇÐ, ÁýÀûȸ·Î°øÇÐ, ÁýÀûȸ·Î¼³°è, ÀÓº£µðµå½Ã½ºÅÛ¼³°è µîÀÇ °ú¸ñÀ» °ÀÇÇϰí ÀÖ´Ù.
ÇлýµéÀ» ±³À°ÇÏ´Â ÀÏ ¿Ü¿¡µµ ¹é ±³¼ö´Â ´ëÁø´ëÇб³ Ư¼ºÈ »ç¾÷°ú °ü·ÃÇÏ¿© (ÁÖ)¿¤¸®¾ÆÅ×Å© ±âÁõ ±âÀÚÀçÀÇ ¼Â¾÷ ¹× Ȱ¼ºÈ¿¡ ¿Â ÈûÀ» ½ñ°í ÀÖ´Ù.
¹é ±³¼ö´Â Àü°ø°ú °ü·ÃÇÏ¿© Æ÷õ»çȸ¿¡ ±â¿©ÇÒ ¼ö ÀÖ´Â ÀÏ¿¡ ´ëÇØ ꡒÁö±Ý ÇöÀç´Â Àü°øÀÇ Æ¯¼º»ó ¾ÆÁ÷ °ü·ÃµÈ ÀÏÀº ¾øÁö¸¸ ÇâÈÄ Æ÷õ Àαٿ¡ ¿¬±¸»ê¾÷´ÜÁö°¡ Á¶¼ºµÇ¸é ¼¾¼¿Í µð½ºÇ÷¹ÀÌ »Ó¸¸ ¾Æ´Ï¶ó, Àü±âÀüÀÚ°øÇаú °ü·ÃÇÏ¿© ¸¹Àº ±â¿©¸¦ ÇÒ ¼ö ÀÖ´Ùꡓ°í ¹àÇû´Ù.
¹é ±³¼ö´Â ¶Ç °æ±âºÏµ¿ºÎ ƯÈ÷ Æ÷õÁö¿ªÀº »ê¾÷±ºÀÌ ÀüÅë»ê¾÷À¸·Î¸¸ Çü¼ºµÇ¾î ÀÖ´Ù. ºÎ°¡°¡Ä¡°¡ ³ôÀº ¿©Å¸ »ê¾÷±ºÀÌ ÇÊ¿äÇÏ´Ù°í °Á¶ÇÑ´Ù.
ꡐÇÏ´ÃÀº ½º½º·Î µ½´Â ÀÚ¸¦ µ½´Â´Ùꡑ¸¦ Æò¼Ò Á¿ì¸íÀ¸·Î »ï¾Æ ¸ÃÀº¹Ù Ã¥ÀÓ°ú Àǹ«¸¦ ´ÙÇÏ´Â ¹é ±³¼ö´Â ±³À°ÀÚÀ̽Š¾Æ¹öÁöÀÇ ¶æ¿¡ µû¶ó ±³¼öÀÇ ±æ·Î ³ª¼¹´Ù°í ÇÑ´Ù.
¹é ±³¼ö´Â Çлý °³Àκ°·Î °üÂûÇϰí À̸¦ ÇлýµéÀÇ °¡Ä¡°ü Çü¼º¿¡ µµ¿òÀÌ µÉ ¼ö ÀÖµµ·Ï Çϰí ÀÌ·Ð ¹× ¼³°è ±³°ú¸ñ »Ó¸¸ ¾Æ´Ï¶ó ½ÇÇè½Ç½À ±³°ú¸ñ¿¡¼µµ ÆÀÀ» ±¸¼ºÇÏ¿© ÁÁÀº °á°ú¹°ÀÌ µµÃâµÇµµ·Ï ÆÀ ±¸¼º¿ø °³°³ÀÎÀÇ ÀÎÈ(Teamwork) Á¤½ÅÀÇ ´Ü·ÃÀ» ¿ä±¸ÇÑ´Ù. Áï, µç»ç¶÷, ³»ç¶÷ÀÌ ¾Æ´Ñ µÈ»ç¶÷À» ¿ä±¸ÇÑ´Ù. ¿äÁò ¸¹Àº ºÐ¾ß¿¡¼ ´Ù¾çÇÑ Àü°øÀ» ¿ä±¸Çϰí Àֱ⠶§¹®¿¡ ´Ù¸¥ Àü°øÀÇ ±¸¼º¿ø°ú Á¶È°¡ ÀÌ·ïÁöÁö ¾ÊÀ¸¸é ¾ÕÀ¸·Î °æÀï¿¡¼ »ì¾Æ³²Áö ¸øÇÑ´Ù. ÀÌ´Â Á¤º¸È¿¡ °¡¼Óµµ°¡ ºÙÀ¸¸é¼ ´õ¿í Àý½ÇÇÏ´Ù.
¹é ±³¼öÀÇ Çб³ ¿¬±¸ ¹× °ÀÇȰµ¿Àº ¹°·Ð Àü°ø°ü·Ã »çȸȰµ¿µµ µ¸º¸ÀδÙ. ÇöÀç Çѱ¹»ê¾÷±â¼úÆò°¡¿ø Áß¼Ò±â¾÷Çõ½Å´Ü µð½ºÇ÷¹À̺аú ½ÉÀÇÀ§¿ø, Á¤º¸Åë½Å¿¬±¸ÁøÈï¿ø ¼¾¼ ¹× ÀÎ½Ä ºÐ°ú ½ÉÀÇÀ§¿ø, Ãæ³²Àü·«»ê¾÷±âȹ´Ü µð½ºÇ÷¹À̺аú ½ÉÀÇÀ§¿ø, ´ë±¸Å×Å©³ëÆÄÅ© µð½ºÇ÷¹À̺аú ½ÉÀÇÀ§¿ø, Àç´Ü¹ýÀÎ °æ±â´ëÁøÅ×Å©³ëÆÄÅ© µð½ºÇ÷¹ÀÌ Àü¹®À§¿øÈ¸ À§¿øÀ¸·Î Ȱµ¿ÁßÀÌ´Ù.
ÇлýµéÀÇ ±³³» Ȱµ¿¿¡ ´ëÇØ ¹é ±³¼ö´Â ÀüÀÚ°øÇаú ½ÇÇè½Ç ³»¿¡ Àü°ø¿µ¿ªº° ÇÐȸ°¡ Ȱ¼ºÈµÇ¾î ÀÖ¾î Çлýµé ½º½º·Î ½ÇÇè°ú À̷м¼¹Ì³ª¸¦ ¼ö½Ã·Î °âÇÒ ¼ö ÀÖ´Ù. ÀÌ´Â ÀÚ±â°è¹ß½Ã ¼Ò¿äµÇ´Â ½Ã°£À» ¸¹ÀÌ ´ÜÃàÇÒ ¼ö ÀÖ´Ù. ÀúÇгâ ÇлýµéÀÌ ½ÇÇè °¨°¢À» ÀÍÈ÷µµ·Ï 1³â¿¡ ÇÑ ¹ø¾¿ ¶óÀÎÆ®·¹À̼ ´ëȸ¸¦ °³ÃÖÇÑ´Ù. ¶ÇÇÑ Á¹¾÷ÀÛǰÀ» ÅëÇØ¼ Á¹¾÷¿¹Á¤ÀÎ ÇлýµéÀÇ »ê¾÷»çȸ ÀûÀÀ´É·ÂÀ» Ű¿öÁÖ°í ÀÖ´Ù. Á¹¾÷ÀÛǰÀº 3Çгâ 2ÇбâºÎÅÍ ÁغñÇÏ¿© 4Çгâ 2ÇбâÃÊ¿¡ ÀÛǰ ¹ßÇ¥¸¦ Çϰí 10¿ù Áß ±³³»․¿Ü Àü½Ãȸ¸¦ °³ÃÖÇÑ´Ù. Çϵå¿þ¾î, ¼ÒÇÁÆ®¿þ¾î, Æß¿þ¾î¸¦ µÎ·ç °âÇ߱⠶§¹®¿¡ ¾î´À ºÐ¾ßµçÁö ÁøÃâÇÒ ¼ö ÀÖ´Â ÀåÁ¡À» °¡Áø´Ù. ÀÌ·¯ÇÑ ÀÌÀ¯·Î Ãë¾÷·üÀÌ ¸Å¿ì ³ô´Ù°í °Á¶ÇÑ´Ù.
±¹Á¦Àü±âÀüÀÚÇÐȸ(IEEE) Á¤È¸¿ø, Çѱ¹Àü±âÀüÀÚÀç·áÇÐȸ Á¤È¸¿ø, ´ëÇÑÀü±âÇÐȸ Á¤È¸¿ø, Çѱ¹Á¤º¸µð½ºÇ÷¹ÀÌÇÐȸ Á¤È¸¿øÀ¸·Î Ȱµ¿Çϰí ÀÖ´Â ¹é ±³¼ö´Â ¾ÕÀ¸·Î ¿¬±¸°èȹ¿¡ ´ëÇØ ÇÃ¶ó½ºÆ½ ±âÆÇ¿¡ ¿Ã¶ó°¡´Â µð½ºÇ÷¹ÀÌ ±¸µ¿È¸·Î ´ÜÀ§ ĨÀ» °³¹ßÇϰí À̸¦ ¹ÙÀÌ¿À ¼¾¼ ³»Áö ÈÇÐ ¼¾¼¿¡ Àû¿ëÇØ ³ª°¥ °èȹÀÌ´Ù.
¹é ±³¼ö´Â ¼®»çÇÐÀ§³í¹® ꡐ2¡¿2 ½ºÀ§Äª¼ÒÀÚ One-Chip ICÈ ¹× °íÀå°ËÃâ¹æ¹ýꡑ, ¹Ú»çÇÐÀ§³í¹®ꡐSLICÀÇ ÀúÀü¾Ð ºí·° ¹× ½ºÀ§Äª ·¹±Ö·¹ÀÌÅÍ ¼³°èꡑÀ» ¹ßÇ¥ÇßÀ¸¸ç ÁÖ¿äÀú¼·Î´Â¢º nMOS/CMOS VLSI ½Ã½ºÅÛ ¼³°è, 1992.7, (ÁÖ)Ķ¶ó¢º¾Õ¼ ¹è¿ì´Â ¸¶ÀÌÅ©·Î½Ã½ºÅÛ, 2000.2, µµ¼ÃâÆÇ ÀÎÅͺñÁ¯ µîÀÌ ÀÖ´Ù.
50´ë ÀÌÈÄ¿¡ ¿Õ¼ºÇÑ ÃâÆÇȰµ¿À» °èȹÇϰí ÀÖ´Â ¹é ±³¼ö°¡ ±×µ¿¾È ¹ßÇ¥ÇÑ ÁÖ¿ä³í¹®Àº ´ÙÀ½°ú °°´Ù.
¢º´ÙÁß Gate ¹× Channel ±¸Á¶¸¦ °®´Â CMOS ¿µ»ó ¼¾¼¿ë Floating-Gate MOSFET ¼ÒÀÚÀÇ Á¦ÀÛ ¹× Ư¼º, Àü±âÇÐȸ³í¹®Áö(C) Àü±â¹°¼º.ÀÀ¿ëºÎ¹®, vol. 50, no. 1, pp. 17-23. (2001.01)¢ºFlexible RFIDÀÇ ±â¼úµ¿Çâ, Àü±âÀüÀÚÀç·á, vol. 17, no. 8, pp. 20-24. (2004.08)¢ºRFID ½ÃÀå ¹× ±â¼úµ¿Çâ, °íºÐÀÚ °úÇаú ±â¼ú, vol. 17, no. 1, pp. 18-26. (2006.2)¢ºÆÐÅÏÀÌ Çü¼ºµÈ ź¼Ò³ª³ëÆ©ºê ¸ÅÆ®ÀÇ ÀÌ»êÈÁú¼Ò °¨ÀÀ Ư¼º, ¼¾¼ÇÐȸÁö, vol. 15, no. 3, pp. 199-204 (2006.5)¢ºMEMS ±â¼úµ¿Çâ, Àü±âÀÇ ¼¼°è, vol. 55, no. 10, pp. 16-23 (2006.10)¢ºAir-gap type film bulk acoustic resonator using flexible thin substrate, Sensors and Actuators Physical A (Elsevier B.V.), vol. 117, no. 1, pp. 62-70. (2005.01.03)¢ºImprovement of porous polysilicon nano-structured emitter for vacuum packaged devices, Journal of Materials Science-Materials in Electronics (Springer Science+Business Media, Inc.), vol. 16, no. 3, pp. 125-130. (2005.03)¢º Low-temperature silicon wafer-scale thermocompression bonding using electroplated gold layers in hermetic packaging, Electrochemical and Solid-State Letters (The Electrochemical Society), vol. 8, no. 12, pp. G330-G332. (2005.12.03)¢º Improvement of field-emission properties of screen-printed carbon nanotube films via argon plasma treatment, Journal of The Electrochemical Society (The Electrochemical Society), vol. 153, no. 6, pp. H111-H114 (2006.06.04)¢ºEnhanced brightness and efficiency of organic light-emitting diodes with an LiF in the Alq3, IEEE Electron Device Letters (IEEE), vol. 27, no. 7, pp. 558-560 (2006.07)¢º Multiwall carbon nanotube sensor for monitoring engine oil degradation, Electrochemical and Solid-State Letters (The Electrochemical Society), vol. 9, no. 8, pp. H78-H80 (2006.08)¢ºCharacterization of an integrated fluorescence-detection hybrid device with photodiode and organic light-emitting diode, IEEE Electron Device Letters (IEEE), vol. 27, no. 9, pp. 746-768 (2006.09)¢º Poly(dimethylsiloxane)-based packaging technique for microchip fluorescence detection system applications, Journal of Microelectromechanical Systems (IEEE), vol. 15, no. 5, pp. 1152-1158 (2006.10)¢ºWafer level hermetic packaging for RF-MEMS devices using electroplated gold layers, Key Engineering Materials (Trans Tech Publications Ltd), vol. 326-328, pp. 617-620 (2006.11)¢ºPatterned multiwall carbon nanotube films as materials of NO2 gas sensors, Sensors and Actuators Chemical B (Elsevier B.V.), vol. 119, no. 1, pp. 180-185 (2006.11.24)¢º Characterization of a passivation layer comprising MgO-SiO2 and ZrO2, Surface and Interface Analysis (John Wiley & Sons, Ltd.), vol. 39, no. 1, pp. 64-68 (2007.01.03)¢º¼³ºñ ¹è°ü³»ÀÇ Å½»ç ¹× µµÀåÀ» À§ÇÑ ·Îº¿ÀåÄ¡, µî·Ï¹øÈ£ 10-0383535-0000. (2003. 04. 28)¢º¹°¹æ¿ïÇü ¼¼Æ÷ ºÎÀ¯¾×À» ÀÌ¿ëÇÑ ¼¼Æ÷ ºÐ¸® ÀåÄ¡, µî·Ï¹øÈ£ 10-0583231-0000. (2006. 05. 18) |